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  Synopsys TetraMAX EDA培訓(xùn)
   入學(xué)要求

        學(xué)員學(xué)習(xí)本課程應(yīng)具備下列基礎(chǔ)知識(shí):
        ◆ 電路系統(tǒng)的基本概念。

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   上課時(shí)間和地點(diǎn)
上課地點(diǎn):【上海】:同濟(jì)大學(xué)(滬西)/新城金郡商務(wù)樓(11號(hào)線白銀路站) 【深圳分部】:電影大廈(地鐵一號(hào)線大劇院站)/深圳大學(xué)成教院 【北京分部】:北京中山學(xué)院/福鑫大樓 【南京分部】:金港大廈(和燕路) 【武漢分部】:佳源大廈(高新二路) 【成都分部】:領(lǐng)館區(qū)1號(hào)(中和大道) 【沈陽(yáng)分部】:沈陽(yáng)理工大學(xué)/六宅臻品 【鄭州分部】:鄭州大學(xué)/錦華大廈 【石家莊分部】:河北科技大學(xué)/瑞景大廈 【廣州分部】:廣糧大廈 【西安分部】:協(xié)同大廈
最近開(kāi)課時(shí)間(周末班/連續(xù)班/晚班)
Synopsys TetraMAX EDA培訓(xùn):2020年3月16日
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  Synopsys TetraMAX EDA培訓(xùn)
培訓(xùn)方式以講課和實(shí)驗(yàn)穿插進(jìn)行

課程描述:

?

OVERVIEW

In this two-day workshop, you will learn how use TetraMAX?--Synopsys' ATPG Tool for SOC design--to perform the following tasks:

  • Generate test patterns for stuck-at faults given a scan gate-level design created by DFT Compiler or other tools
  • Describe the test protocol and test pattern timing using STIL
  • Debug DRC and stuck-at fault coverage problems using the Graphical Schematic Viewer
  • Troubleshoot fault coverage problems
  • Save and validate test patterns
  • Troubleshoot simulation failures

This class includes an overview of the fundamentals of manufacturing test, such as:

  • What is manufacturing test?
  • Why perform manufacturing test?
  • What is a stuck-at fault?
  • What is a scan chain?

This class also includes a brief overview of the DSM Test Failure Diagnosis and Adaptive Scan features in TetraMAX?.

?

OBJECTIVES

At the end of this workshop the student should be able to:

  • Incorporate TetraMAX? ATPG in a design and test methodology that produces desired fault coverage, ATPG vector count and ATPG run-time for a full-scan or almost full-scan design
  • Create a STIL Test Protocol File for a design by using QuickSTIL menus or commands, DFT Compiler or from scratch
  • Use the Graphical Schematic Viewer to analyze and debug warning messages from Design Rule Check or fault coverage problems after ATPG
  • Customize a Test Protocol for a design that requires special circuit initialization, scan shift or capture procedures or pattern timing
  • Describe when and how to use at least four options to increase test coverage and/or decrease the number of required test patterns
  • Save test patterns in a proper format for simulation and transfer to an ATE
  • Validate test patterns using STIL Direct Pattern Validation

AUDIENCE PROFILE

ASIC, SoC or Test Engineers who perform ATPG at the Chip or SoC level.

?

PREREQUISITES

To benefit the most from the material presented in this workshop, students should: Have taken the DFT Compiler 1 workshop or possess equivalent knowledge with DFT Compiler and fundamentals of manufacturing test including:

  • Understanding the differences between manufacturing and design verification testing
  • Stuck-at fault model
  • Internal and boundary scan chains
  • Scan shift and capture violations
  • Major scan design-for-test rules concerning flip-flops, latches and bi-directional/tri-state drivers
  • Tradeoffs between having single or multiple
  • Understanding of digital IC logic design
  • Working knowledge of Verilog or VHDL language
  • Familiarity with UNIX workstations running X-windows
  • Familiarity with vi, emacs, or other UNIX text editors

COURSE OUTLINE

?

第一階段:

Introduction to ATPG Test

Building ATPG Models

Running DRC

Controlling ATPG

?

第二階段:

Minimizing ATPG Patterns

Writing ATPG Patterns

Pattern Validation

Diagnosis

??? Conclusion

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